Summer Research Internship
Project 11: Modelling and Simulation of Debris Attachment on the CMM Stylus and the Impact on Measurement Accuracy
Release time:2020-12-22 Read the number:7959


Contact Information:

Asso. Prof. Xiaobing Feng  



Project Description and Objectives:

Coordinate measurement machines (CMMs) are widely used in industry to measure the geometrical dimensions of products as a part of the quality control process. During measurement, debris particles adhere to the surface of the CMM stylus tip. Such debris significantly impairs the dimensional accuracy of a CMM, which is critical for the measurement of precision-engineered products. This project will investigate the impact of the debris particles on the measurement accuracy of the CMM. The phenomenon of particle adhesion on the CMM stylus will be modeled. Simulation of particle adhesion and deformation will be conducted. The outcome of the project will help determine the significance of debris attachment during several CMM measurement tasks commonly used in industry and potential measurement errors.


Eligibility Requirements:

  • 3rd year and above undergraduate students majoring in Mechanical/Electrical/Sensory engineering.
  • Students with research experience are highly desired.
  • Knowledge on metrology and/or CMNC machine tool is highly desired.


Main Tasks: 

Participant will carry out particle mechanics analysis of debris involved in CMM measurement, investigate the debris attachment/detachment mechanism, and conduct a simulation of debris attachment on the CMM stylus tip during measurement.



Lab: N/A



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